High Speed Digital Design

[ztnel]

The following items were taken from a great YouTube walkthrough of the effects of bypass capacitors here. I have noted them below for our reference:

• Small bypass capacitors (~0.01µF) for the high frequency switching components (ICs)
• Large bulk decoupling capacitors (~100-400µF) for smoothing lower frequency rippling at the Vcc/GND connectors
• Low loop area for EMI reduction: Placing bypass capacitors as close to the IC chips as possible to reduce the lowest impedance loop area. Important for CRTC compliance.
• SMT capacitors provide the lowest lead inductance

When we are out of the prototyping stage I recommend we move to surface mounted technology (SMT) for its better component performances in high speed digital applications